- 0133 ECS-DoT-22 leads; eight in product design.
- 02First 16nm samples received; testing underway.
- 03Pipeline has no binding supply deals or revenue commitments.
Nanoveu (ASX: NVU) has built a pipeline of 33 active customer opportunities for its ECS-DoT-22 semiconductor, with eight prospective customers incorporating the chip into specific product designs.
Three further customers were evaluating the 22-nanometre (nm) device on development kits at the end of September, while the remaining 22 opportunities were in earlier engagement and qualification stages.
The technology group received its first packaged 16nm ECS-DoT engineering samples from Taiwan Semiconductor Manufacturing Company during the quarter, adding another device to its ultra-low-power AI portfolio.
The 16nm engineering samples incorporate Bluetooth Low Energy connectivity, expanded memory, dedicated object-detection hardware, and a floating-point processing unit, with functional and power testing still underway.
The developments accompanied the acquisition of Spinoff Robotics and further drone testing, although Nanoveu emphasised that its semiconductor pipeline contained no binding supply agreements or revenue commitments.
EMASS Customer Engagement
Nanoveu subsidiary Embedded A.I. Systems Pte Ltd (EMASS) is working with prospective customers across wearable devices, smart homes, computing, industrial tracking, and audio products, with 20 opportunities in North America, 12 in Asia-Pacific and one in Europe.
EMASS continued technical verification ahead of full-mask production of the 22nm chip, manufactured additional evaluation boards, and worked on development tools to support customers.
“Always-on AI inside battery-powered devices is a market the big chip makers have not claimed, and ECS-DoT-22 goes into it with efficiency the published benchmarks put well ahead of the competition,” executive chair David Pevcic said.
“This quarter showed what that means commercially: 33 customer opportunities, with eight product teams at multinational and specialist companies working with our chip on specific designs across wearables, hearables, smart home, computing, and industrial applications.”
“Our task is to turn ECS-DoT’s position into design wins and volume supply, and the whole company is organised around that.”
Partnerships and Robotics Expansion
EMASS released an asset-tracking reference design with Bosch Sensortec combining five sensors with on-device AI processing, enabling customers to evaluate location and environmental monitoring applications.
Its object-detection technology gained protection through a US patent exclusively licensed to EMASS, with the relevant circuitry incorporated in the 16nm chip.
Nanoveu completed its acquisition of Spinoff Robotics in July through the issue of three million shares and four million performance rights tied to specified milestones, without cash consideration.
Spinoff contributed the ALICE tethered aerial platform and METRON 3D measurement system, while second-phase flight trials recorded peak cruise-efficiency improvements of 51% at seven metres per second with ECS-DoT active.
A non-binding memorandum of understanding with NovaPeak proposes assessing METRON integration with infrastructure-inspection software, with any commercial arrangement dependent on validation and definitive agreements.
Other Commercial Deliveries
Outside semiconductors and robotics, Nanoveu signed a binding agreement with One Immersive for an EyeFly3D pilot in India, backed by a US$300,000 purchase order for mobile-device films.
Its Hong Kong subsidiary completed delivery of approximately 52,000 Apple-device films, while subsequent purchases and Indian exclusivity remain subject to performance conditions.
Nanoveu finished September with $3.08 million in cash after using $2.10m in operating activities during the quarter, equivalent to approximately 1.5 quarters of funding at that spending rate.
The group identified 129.2 million unlisted options expiring within two quarters that could raise approximately $5.56m if exercised in full, while considering strategic partnerships and other funding pathways.
Management expects some front-loaded costs to ease as it prioritises customer design wins, semiconductor verification and further robotics deployments, but additional sales and financing outcomes remain uncertain.
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